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GB 14048 consists of the following parts, under the general title Low-voltage Switchgear and Controlgear:
— Part 1: General Rules;
— Part 2: Circuit-breakers;
— Part 3: Switches Disconnectors Switch-disconnectors and Fuse-combination Units;
— Part 4-1: Contactors and Motor-starters — Electromechanical Contactors and motor-starters (Including Motor Protector);
— Part 4-2: Contactors and Motor-starters — AC Semiconductor Motor Controllers and Starters (Including Soft-starter);
— Part 4-3: Contactors and Motor-starters — AC Semiconductor Controllers and Contactors for Non-motor Loads;
— Part 5-1: Control Circuit Devices and Switching Element — Electromechanical Control Circuit Devices;
— Part 5-2: Control Circuit Devices and Switching Element — Proximtiy Switches;
— Part 5-3: Control Circuit Devices and Switching Elements — Requirements for Proximity Devices with Defined Behaviour under Fault Conditions (PDF);
— Part 5-4: Control Circuit Devices and Switching Elements — Method of Assessing the Performance of Low-energy Contacts - Special Tests;
— Part 5-5: Control Circuit Devices and Switching Elements — Electrical Emergency Stop Device with Mechanical Latching Function;
— Part 5-6: Control Circuit Devices and Switching Elements — DC Interface for Proximity Sensors and Switching Amplifiers (NAMUR);
— Part 5-7: Control Circuit Devices and Switching Elements — Requirements for Proximity Devices with Analogue Output;
— Part 5-8: Control Circuit Devices and Switching Elements — Three-position Enabling Switches;
— Part 5-9: Control Circuit Devices and Switching Elements — Flow Rate Switches;
— Part 6-1: Multiple Function Equipment — Transfer Switching Equipment;
— Part 6-2: Multiple Function Equipment - Control and Protective Switching Devices (or Equipment) (CPS);
— Part 7-1: Ancillary Equipment - Terminal Blocks for Copper Conductors;
— Part 7-2: Ancillary Equipment - Protective Conductor Terminal Blocks for Copper Conductors;
— Part 7-3: Ancillary Equipment — Safety Requirements for Fuse Terminal Blocks;
— Part 8: Control Units for Built-in Thermal Protection (PTC) for Rotating Electrical Machines.
This part is Part 5-2 of GB 14048, and numbered GB/T 14048.10.
This part is drafted in accordance with the rules given in the GB/T 1.1-2009.
This part replaces GB 14048.10-2008 Low-voltage Switchgear and Controlgear — Part 5-2: Control Circuit Devices and Switching Element — Proximtiy Switches.
In addition to a number of editorial changes, the following technical deviations have been made with respect to the GB/T 14048.10-2008 (the previous edition):
— Table 3 is modified, and 8 poles M12 connector and 12 poles M12 connector are added;
— Voltage dips immunity test and voltage interruptions immunity test specified in Table 7 are modified;
— Figure D.8 M5 Thread 4-pin/3-pin Integral Connector for d.c. Proximity Switches is added;
— Annex A is revised as informative.
This part is identical with International Standard IEC60947-5-2:2012 Low-voltage Switchgear and Controlgear — Part 5-2: Control Circuit Devices and Switching Elements — Proximity Switches.
The Chinese documents having corresponding consistency relationship with the normative international documents referenced in this part are given below:
— GB/T 2423.5-1995 Environmental Testing for Electric and Electronic Products — Part 2: Test Methods — Test Ea and Guidance: Shock (IEC 60068-2-27:1987, IDT)
— GB/T 2423.10-2008 Environmental Testing for Electric and Electronic Products — Part 2: Tests Methods — Test Fc: Vibration (Sinusoidal) (IEC 60068-2-6:1995, IDT)
— GB 14048.1-2012 Low-voltage Switchgear and Controlgear — Part 1: General Rules (IEC 60947-1:2011, MOD)
— GB 16895 (all parts) Electrical Installations of Buildings [IEC 60364 (all parts), IDT]
— GB 17625.2-2007 Electromagnetic Compatibility (EMC) — Limits — Limitation of Voltage Changes, Voltage Fluctuations and Flicker in Public Low-voltage Supply Systems, for Equipment with Rated Current ≤16A per Phase and not Subject to Conditional Connection (IEC 61000-3-3:2005 IDT)
— GB/T17626.2-2006 Electromagnetic Compatibility — Testing and Measurement Techniques — Electrostatic Discharge Immunity Test (IEC 61000-42:2001, IDT)
— GB/T 17626.3-2006 Electromagetic Compatibility — Testing and Measurement Techniques — Radiated Radio-frequency Electromagnetic Field Immunity Test (IEC 61000-4-3:2002, IDT)
— GB/T 17626.6-2008 Electromagetic Compatibility — Testing and Measurement Techniques — Immunity to Conducted Disturbances, Induced by Radio-frequency Fields (IEC 61000-4-6:2006, IDT)
— GB/T17626.8-2006 Electromagetic Compatibility — Testing and Measurement Techniques — Power Frequency Magnetic Field Immunity Test (IEC 61000-482001, IDT)
— GB/T 17626.13-2006 Electromagnetic Compatibility — Testing and Measurement Techniques — Harmonics and Interharmonics Including Mains Signalling at A.C. Power Port, Low Frequency Immunity Test (IEC 61000-4-13:2002, IDT)
— GB/T 18501.2 (all parts) Connectors for Use in d.c., Low-frequency Analogue and Digital High Speed Data Applications — Part 2: Circular Connectors with Assessed Quality - Sectional Specification [IEC 61076-2 (all parts), IDT]
For the purposes of this part, the following editorial changes have also been made according to the specific conditions of China:
— IEC Foreword of the International Standard is deleted;
— The catalogue of definitions disposed in alphabetical order (see IEC 60947-5-2:2012, Clause 2) is deleted from this part;
— In order to maintain the consistency of the table number, Tables 7, 8 and 6 in IEC 60947-5-2:2012 are adjusted to Table 6, 7 and 8 in this part.
This part was proposed by the China Electrical Equipment Industrial Association.
This part was prepared by SAC/TC 189 (National Technical Committee on Low-voltage Apparatus of Standardization Administration of China).
The previous editions of this part are as follows:
— GB/T 14048.10-2008, GB/T 14048.10-1999.
Low-voltage Switchgear and Controlgear — Part 5-2: Control Circuit Devices and Switching Elements — Proximity Switches
1 General Requirements
The provisions of the general rules in IEC 60947-1 are applicable to this part, where specifically called for. General rules clauses and subclauses thus applicable, as well as tables, figures and annexes, are identified by references to IEC 60947-1, e.g. subclause 7.1.9.3 of IEC 60947-1:2007 + A1:2010 or Annex C of IEC 60947-1:2007 + A1:2010.
Clauses 1 to 8 contain the general requirements. Specific requirements for the various types of proximity switches are given in Annex A.
Integral connectors for plug-in proximity switches are given in Annex D. Various symbols for proximity switches are given in Annex F.
1.1 Scope and Object
This part applies to inductive and capacitive proximity switches that sense the presence of metallic and/or non-metallic objects, ultrasonic proximity switches that sense the presence of sound reflecting objects, photoelectric proximity switches that sense the presence of objects and non-mechanical magnetic proximity switches that sense the presence of objects with a magnetic field.
These proximity switches are self-contained, have semiconductor switching elements(s) and are intended to be connected to circuits, the rated voltage of which does not exceed 250 V 50 Hz/60 Hz a.c. or 300 V d.c. This Standard is not intended to cover proximity switches with analogue outputs.
The object of this part is to state for proximity switches:
— definitions;
— classification;
— characteristics;
— product information;
— normal service, mounting and transport conditions;
— constructional and performance requirements;
— tests to verify rated characteristics.
1.2 Normative References
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
GB/T 2423.4-2008 Environmental Testing for Electric and Electronic Products — Part 2: Test method — Test Db: Damp Heat, Cyclic (12h + 12h Cycle) (IEC 60068-2-30:2005, IDT)
GB/T 2423.22-2012 Environmental Testing for Electric and Electronic Products — Part 2: Test Methods Test N: Change of Temperature (IEC 60068-2-14:2009, IDT)
GB 4824-2013 Industrial, Scientific and Medical (ISM) Radio-frequency Equipment — Electromagnetic Disturbance Characteristics — Limits and Methods of Measurement (CISPR 11: 2010, IDT)
GB/T 17045-2006 Protection Against Electric Shock — Common Aspects for Installation and Equipment (IEC 61140:2001, IDT)
GB 17625.1-2012 Electromagnetic Compatibility — Limits — Limits for Harmonic Current Emissions (Equipment Input Current ≤ 16A Per Phase) (IEC 61000-3-2:2009, IDT)
GB/T 17626.4-2008 Electromagnetic Compatibility — Testing and Measurement Techniques — Electrical Fast Transient/Burst Immunity Test (IEC 61000-1-4:2004, IDT)
GB/T 17626.11-2008 Electromagnetic Compatibility — Testing and Measurement Techniques — Voltage Dips, Short Interruptions and Voltage Variations Immunity Tests (IEC 6100-4-11:2004, IDT)
IEC 60050(441):1984 International Electrotechnical Vocabulary(IEV) — Chapter 441: Switchgear, Controlgear and Fuses
IEC 60050(441):1984/A1:2000 Amendment 1, 2000
IEC 60068-2-6:2007 Environmental Testing — Part 2-6: Tests Test Fc: Vibration (Sinusoidal)
IEC 60068-2-27:200 Environmental testing — Part 2-27: Tests — Test Ea and Guidance: Shock
IEC 60364 (all parts) Low-voltage Electrical Installations
IEC 60947-1:2007 Low-voltage Switchgear and Controlgear — Part 1: General Rules
IEC 60947-1:2007/A1:2010 Amendment 1, 2010
IEC 61000-3-3:2008 Electromagnetic Compatibility(EMC) — Part3-3: Limits — Limitation of Voltage Changes, Voltage Fluctuations and Flicker in Public Low-voltage Supply Systems, for Equipment with Rated Current ≤16 A Per Phase and not Subject to Conditional Connection
IEC 61000-4-2:2008 Electromagnetic Compatibility(EMC) — Part 4-2: Testing and Measurement Techniques — Electrostatic Discharge Immunity Test
IEC 61000-4-3:2006 Electromagnetic Compatibility (EMC) — Part4-3: Testing and Measurement Techniques — Radiated, Radio-frequency, Electromagnetic Field Immunity Test
IEC 61000-4-3:2006/A1:2007 Amendment 1, 2007
IEC 61000-4-3:2006/A2:2010 Amendment 2, 2010
IEC 61000-4-6:2008 Electromagnetic Compatibility (EMC) — Part 4-6: Testing and Measurement Techniques — Immunity to Conducted Disturbances, Induced by Radio-frequency Fields
IEC 61000-4-8:2009 Electromagnetic Compatibility (EMC) — Part 4-8: Testing and Measurement Techniques — Power Frequency Magnetic Field Immunity Test
IEC 61000-4-13:2002 Electromagnetic Compatibility (EMC) — Part4-13: Testing and Measurement Techniques — Harmonics and Interharmonics Including Mains Signalling at a. c Power Port, Low Frequency Immunity Tests
IEC 610004-13:2002/A1:2009 Amendment 1, 2009
IEC 61076-2 (all part) Connectors for Electronicequipment — Product Requirements — Part 2: Circular Connectors
ISO 630 (all part) Structural Steels
2 Terms and Definitions
For the purpose of this document, the terms and definitions given in IEC 60947-1:2007 + A1:2010 and the following apply.
2.1 Basic Definitions
2.1.1
proximity switch
a position switch which is operated without mechanical contact with the moving part [IEV 441-14-51]
2.1.1.1
inductive proximity switch
a proximity switch producing an electromagnetic field within a sensing zone and having a semiconductor switching element
2.1.1.2
capacitive proximity switch
a proximity switch producing an electric field within a sensing zone and having a semiconductor switching element
2.1.1.3
ultrasonic proximity switch (see Figure 2)
a proximity switch transmitting and receiving ultrasound waves within a sensing zone and having a semiconductor switching element
2.1.1.4
photoelectric proximity switch (see Figure 1)
a proximity switch which senses objects that either reflect or interrupt visible or invisible light and having a semiconductor switching element
2.1.1.4.1
type D
diffuse reflective photoelectric proximity switch which is directly operated through lateral or axial approach to its reference axis by a defined object
2.1.1.4.2
type R
retroreflective photoelectric proximity switch which is indirectly operated through lateral approach to its reference axis between emitter-receiver and reflector by a defined object
2.1.1.4.3
type T
through beam photoelectric proximity switch which is indirectly operated through lateral approach of its reference axis between emitter and receiver by a defined object
2.1.1.5
non-mechanical magnetic proximity switch
proximity switch which senses the presence of a magnetic field and has a semiconductor switching element and no moving parts in the sensing element
2.1.1.6
direct operated proximity switch
proximity switch which detects its target without the use of an external means, e.g. a reflector
2.1.1.7
indirect operated proximity switch
proximity switch which detects its target with the use of an external means, e.g. a reflector
2.1.1.8
neutral density filters
filters which uniformly attenuate the intensity of light over a broad spectral range
Note: Attenuation is accomplished by using either a light-absorbing glass or a thin-film metal coating that combines absorption and reflection.
2.2 Parts of a Proximity Switch
2.2.1
semiconductor switching element
an element designed to switch the current of an electric circuit by controlling conductivity of a semiconductor
2.2.2
Reference axis
2.2.2.1
reference axis for inductive, capacitive, non-mechanical magnetic and ultrasonic proximity switches
an axis perpendicular to the sensing face and passing through its centre
2.2.2.2
reference axis for types R and D photoelectric proximity switches
an axis located midway between the optical axis of the emitter and this of receiver elements or lenses (see Figure 1)
2.2.2.3
reference axis for type T photoelectric proximity switches
an axis perpendicular to the centre of the emitter
2.2.3
standard target
a specified object used for making comparative measurements of the operating distances and sensing distances
2.2.4
free zone
a volume around the proximity switch which is kept free from any material capable of affecting the characteristics of the proximity switch
2.2.5
damping material
a material which has an influence on the characteristics of a proximity switch
2.2.6
non-damping material
a material which has negligible influence on the characteristics of a proximity switch
2.2.7
sound-reflecting material
a material which reflects the ultrasound waves and gives detectable echoes
2.2.8
sound-absorbing material
a material with negligible reflecting characteristics for ultrasound waves which gives no detectable echo
2.2.9
embeddable proximity switch
a proximity switch is "embeddable" when any damping material can be placed around the sensing face plane without influencing its characteristics
2.2.10
non-embeddable proximity switch
a proximity switch is "non-embeddable" when a specified free zone around its sensing face is necessary in order to maintain its characteristics
2.2.11
Sensing face
2.2.11.1
sensing face of an inductive proximity switch
a surface of the proximity switch through which the electromagnetic field emerges
2.2.11.2
sensing face of a capacitive proximity switch
a surface of the proximity switch through which the electric field emerges
2.2.11.3
sensing face of an ultrasonic proximity switch
a surface of the proximity switch where ultrasound is transmitted and received
2.2.11.4
sensing face of a non-mechanical magnetic proximity switch
a surface of the proximity switch through which the change in a magnetic field is detected
2.2.12
emitter
the light source, lens and necessary circuitry which provide the light beam
2.2.13
receiver
the detector, lens and necessary circuitry to monitor the presence of the light beam from the emitter
2.2.14
reflector
a specified device used to reflect light back to the receiver for type R photoelectric proximity switches
2.2.15
Adjuster
2.2.15.1
adjuster of a capacitive proximity switch
a part of capacitive proximity switch used to set the operating distance. Its use compensates for influence due to target material, transmission medium and installation (mounting) conditions
2.2.15.2
adjuster of an ultrasonic or a photoelectric proximity switch
a part of an ultrasonic or a photoelectric proximity switch used to set the operating distance within the sensing range
2.3 Operation of a Proximity Switch
2.3.1
operating distances
S
a distance at which the target approaching the sensing face along the reference axis causes the output signal to change
2.3.1.1
rated operating distance
Sn
the rated operating distance is a conventional quantity used to designate the operating distances. It does not take into account either manufacturing tolerances or variations due to external conditions such as voltage and temperature
2.3.1.2
sensing range
Sd
the range within which the operating distance may be adjusted
2.3.1.2.1
minimum operating distance
the lower limit of the specified sensing range of an ultrasonic or photoelectric proximity switch
2.3.1.2.2
maximum operating distance
the upper limit of the specified sensing range of an ultrasonic or photoelectric proximity switch
2.3.1.3
blind zone
the zone between the sensing face and the minimum operating distance, where no object can be detected
2.3.1.4
total beam angle
the solid angle around the reference axis of an ultrasonic proximity switch, where the sound level drops by 3 dB
2.3.1.5
effective operating distance
Sr
the operating distance of an individual proximity switch, measured at stated temperature, voltage and mounting conditions
2.3.1.6
usable operating distance
Su
the operating distance of an individual proximity switch, measured under specified conditions
2.3.1.7
assured operating distance
Sa
the distance from the sensing face within which the correct operation of the proximity switch under specified conditions is assured
2.3.1.8
operating range
ro
range within which a lateral approach of the target causes the output signal of a through beam or retroreflective proximity switch to change
2.3.2
lateral approach
the approach of the target perpendicular to the reference axis
2.3.3
axial approach
the approach of the target with its centre maintained on the reference axis
Foreword III
1 General Requirements
1.1 Scope and Object
1.2 Normative References
2 Terms and Definitions
2.1 Basic Definitions
2.2 Parts of a Proximity Switch
2.3 Operation of a Proximity Switch
2.4 Switching Element Characteristics
3 Classification
3.1 Classification According to Sensing Means
3.2 Classification According to the Mechanical Installation
3.3 Classification According to the Construction Form and Size
3.4 Classification According to Switching Element Function
3.5 Classification According to Type of Output
3.6 Classification According to Method of Connection
4 Characteristics
4.1 Summary of Characteristics
4.2 Operating Conditions
4.3 Rated and Limiting Values for the Proximity Switch and Switching Elements
4.4 Utilization Categories for the Switching Element
5 Product Information
5.1 Nature of Information — Identification
5.2 Marking
5.3 Instructions for Installation, Operation and Maintenance
6 Normal Service, Mounting and Transport Conditions
6.1 Normal Service Conditions
6.2 Conditions During Transport and Storage
6.3 Mounting
7 Constructional and Performance Requirements
7.1 Constructional Requirements
7.2 Performance Requirements
7.3 Physical Dimensions
7.4 Shock and Vibration
8 Tests
8.1 Kinds of Tests
8.2 Compliance with Constructional Requirements
8.3 Performances
8.4 Testing of Operating Distances
8.5 Testing for the Frequency of Operating Cycles
8.6 Verification of the Electromagnetic Compatibility
8.7 Test Results and Test Report
Annex A (Informative) Typical Dimensions and Operating Distances of Proximity Switches
Annex B (Normative) Class II Proximity Switches Insulated by Encapsulation — Requirements and Tests
Annex C (Normative) Additional Requirements for Proximity Switches with Integrally Connected Cables
Annex D (Normative) Integral Connectors for Plug-in Proximity Switches
Annex E (Normative) Additional Requirements for Proximity Switches Suitable for Use in Strong Magnetic Fields
Annex F (Informative) Symbols for Proximity Switches
Figure 1 Sensing Range and Operating Range of Photoelectric Proximity Switches
Figure 2 Ultrasonic Proximity Switch Operating Distances
Figure 3 Relationship between Operating Distances of Inductive and Capacitive Proximity Switches
Figure 4 Relationship between Operating Distances of Ultrasonic Proximity Switches
Figure 5 Method of Measuring the Operating Distance (8.3.2.1 and 8.4.1)
Figure 6 Test Circuit for the Verification of Time Delay Before Availability
Figure 7 Signal Output Across Load in Figure
Figure 8 Test Circuit for the Verification of Minimum Operational Current OFF-state current, Voltage Drop and Independent Snap Action
Figure 9 Test Circuit for the Verification of Making and Breaking Capability
Figure 10 Short-circuit Testing
Figure 11 Testing of the Sensing Range
Figure 12 Methods for Measuring the Operating Frequency of Inductive, capacitive and Non-mechanical Magnetic Proximity Switches (if applicable)
Figure 13 Methods for measuring the operating frequency f, ultrasonic proximity switch
Figure 14 Output Signal of Direct Current Proximity Switch During the Measurement of Operating Frequency f
Figure 15 Measurement Means for Turn-on Time ton and Turn-off Time toff
Figure 16 Turn-on Time ton Measurement
Figure 17 Turn-off Time toff Measurement
Table 1 Classification of Proximity Switches
Table 2 Utilization Categories for Switching Elements
Table 3 Connection and Wiring Identification
Table 4 Verification of Making and Breaking Capacities of Switching Elements Under Normal Conditions Corresponding to the Utilization Categories
Table 5 Verification of Making and Breaking Capacities of Switching Elements Under Abnormal Conditions Corresponding to the Utilization Categories
Table 6 Acceptance Criteria
Table 7 Immunity Tests
Table 8 Test Voltages
低压开关设备和控制设备 第5-2部分：
控制电路电器和开关元件 接近开关
1基本要求
本部分采用IEC 60947-1《低压开关设备和控制设备总则 第1部分：总则》的有关条款，当采用时，本部分将特别声明。本部分在采用总则的条款以及表格、图、附录时，将标出所采用的具体条款号，例如：IEC 60947-1：2007＋A1：2010的7.1.9.3，IEC 60947-1：2007＋A1：2010附录C。
第1章至第8章为接近开关的一般要求。各种类型接近开关的特殊要求参见附录A。
插入式接近开关的整体接插件图例见附录D。各种接近开关的符号参见附录F。
1.1 适用范围和目的
本部分适用于能检测金属的和(或)非金属的物体存在与否的电感式和电容式接近开关、能检测反射声音物体存在与否的超声波式接近开关、能检测物体存在与否的光电式接近开关和能检测磁性物体存在与否的非机械磁性式接近开关。
上述接近开关应是全封闭式，并且具有半导体开关元件，可用于连接额定电压交流不超过250V(50Hz或60Hz)，或直流不超过300V的电路。本部分不适用于具有模拟量输出的接近开关。
本部分旨在说明接近开关的下列内容：
——定义；
——分类；
——特性；
——产品信息；
——正常使用、安装和运输条件；
——结构和性能要求；
——额定特性的验证试验。
1.2 规范性引用文件
下列文件对于本文件的应用是必不可少的。凡是注日期的引用文件，仅注日期的版本适用于本文件。凡是不注日期的引用文件，其最新版本(包括所有的修改单)适用于本文件。
GB/T 2423.4—2008 电工电子产品环境试验 第2部分：试验方法 试验Db 交变湿热(12 h＋12h循环)(IEC 60068-2-30；2005，IDT)
GB/T 2423.22-2012 电工电子产品基本环境试验规程 第2部分：试验方法 试验N：温度变化(IEC 60068-2-14：2009.IDT)
GB 4824-2013 工业、科学和医疗(ISM)射设备 电磁骚扰特性 限值和测量方法(CISPR 11： 2010. IDT)
GB/T 17045-2006 电击防护 装置和设备的通用部分(IEC 61140：2001，IDT)
GB 17625.1-2012 电磁兼容 限值 谐波电流发射限值(设备每相输入电流≤16A(IEC 61000-3-2：2009，IDT)
GB/T 17626.4-2008 电磁兼容 试验和测量技术 电快速瞬变脉冲群抗扰度试验(IEC 61000-1-4：2004.IDT）
GB/T 17626.11—2008 电磁兼容 试验和测量技术 电压暂降、短时中断和电压变化的抗扰度试验(IEC 6100-4-11：2004，DT)
IE 60050(441)：1984 国际电工术语(IEV) 第441章：开关设备、控制设备和熔断器[International Electrotechnical Vocabulary(IEV)-Chaper 441： Switchgear， controlgear and fuses]
IEC 60050(441)：1984/A1：2000 第1号修改单( Amendment 1，2000)
IEC 60068-2-6：2007 环境试验 第2-6部分：试验 试验Fc：振动(正弦)[Environmental testing-Part 2-6： Tests Test Fc： Vibration(sinusoidal)]
IEC 60068-2-27：2008环境试验 第2-27部分：试验 试验Ea：冲击( Environmental testing—Part 2-27： Tests—Test Ea and guidance： Shock)
IEC 60364(所有部分) 建筑物电气装置(Low-voltage electrical installations)
IEC 60947-1：2007 低压开关设备和控制设备 第1部分：总则(Low-voltage switchgear and con—trolgear—Part 1： General rules)
IEC 60947-1：2007/A1：2010 第1号修改单( Amendment 1，2010)
IEC 61000-3-3：2008 电磁兼容 限值 对每相额定电流≤16A且无条件接入的设备在公用低压供电系统中产生的电压变化、电压波动和闪烁的限制[Electromagnetic compatibility(EMC)-Part3-3：Limits—Limitation of voltage changes， voltage fluctuations and flicker in public low-voltage supply systems， for equipment with rated current ≤16 A per phase and not subject to conditional connection]
IEC 61000-4-2：2008 电磁兼容(EMC) 第4-2部分：试验和测量技术 静电放电抗扰度试验[Electromagnetic compatibility(EMC)—Part 4-2： Testing and measurement techniques—Electrostatic discharge immunity test]
IEC 61000-4-3：2006 电磁兼容(EMC) 第4-3部分：试验和测量技术 射频场感应的传导骚扰抗扰度试验[ Electromagnetic compatibility (EMC)—Part4-3： Testing and measurement techniques—Radiated， radio-frequency， electromagnetic field immunity test]
IEC 61000-4-3：2006/A1：2007 第1号修改单(Amendment 1，2007)
IEC 61000-4-3：2006/A2：2010 第2号修改单(Amendment 2，2010)
IEC 61000-4-6：2008 电磁兼容(EMC) 第4-6部分：试验和测量技术 射频场感应的传导骚抗扰度[Electromagnetic compatibility (EMC)—Part 4-6： Testing and measurement techniques—Immunity to conducted disturbances， induced by radio-frequency fields]
IEC 61000-4-8：2009 电磁兼容(EMC) 第4-8部分：试验和测量技术 工频磁场抗扰度试验[Electromagnetic compatibility (EMC)—Part 4-8： Testing and measurement techniques—Power frequency magnetic field immunity tes]
IEC 61000-4-13：2002 电磁兼容 第4-13部分：试验和测量技术 交流电源端口 谐波和谐间波及电网信号抗扰度试验[ Electromagnetic compatibility(EMC)—Part4-13： Testing and measurement techniques-Harmonics and interharmonics including mains signalling at a. c power port， low frequency immunity tests]
IEC 610004-13：2002/A1：2009 第1号修改单( Amendment 1，2009)
IEC 61076-2(所有部分) 电子设备连接器 产品要求 第2部分：圆形连接器( Connectors for electronicequipment—Product requirements—Part 2： Circular connectors）
ISO 630(所有部分) 结构钢( Structural steels)
2 术语和定义
IEC 60947-1：2007＋A1：2010界定的以及下列术语和定义适用于本文件。
2.1基本定义
2.1.1
接近开关 proximity switch
与运动部件无机械接触而能动作的位置开关[IEV 441-14-51]。
2.1.1.1
电感(应)式接近开关 inductive proximity switch
能在检测区产生电磁场且具有半导体开关元件的接近开关。
2.1.1.2
电容式接近开关 capacitive proximity switch
能在检测区产生电场且具有半导体开关元件的接近开关。
2.1.1.3
超声波式接近开关 ultrasonic proximity switch(见图2)
能在检测区发射和接受超声波且具有半导体开关元件的接近开关。
2.1.1.4
光电式接近开关 photoelectric proximity switch(见图1)
能检测可反射或阻断可见光或不可见光的物体，并且具有半导体开关元件的接近开关。
D型 type D
由一规定的物体通过横向或轴向接近其基准轴进行直接动作的漫射光电式接近开关。
R型 type R
由一规定的物体在发光器-受电器组件与反光器之间通过横向接近其基准轴进行间接动作的回射光电式接近开关。
2.1.1.4.3
T型 type T
由一规定的物体在发光器与受光器之间通过横向接近其基准轴进行间接动作的对射光电式接近开关。
2.1.1.5
非机械磁性式接近开关non- mechanical magnetic proximity switch
能检测磁场存在与否，并具有半导体开关元件且检测元件中无运动部件的接近开关。
2.1.1.6
直接动作接近开关 direct operated proximity switch
不使用外部设备，如反光器，而能检测标靶的接近开关。
2.1.1.7
间接动作接近开关 indirect operated proximity switch
使用外部设备，如反光器，才能检测标靶的接近开关。
2.1.1.8
中密度滤光器 neutral density filters
能在一宽光谱范围内均匀地衰减光照度的过滤器。
注：衰减功能是采用吸光玻璃或采用具有吸收和反射相结合的薄片金属来达到的。
2.2接近开关部件
2.2.1
半导体开关元件 semiconductor switching element
利用半导体的可控导电性通断电路电流的元件。
2.2.2
基准轴 reference axis
2.2.2.1
电感式、电容式、非机械磁性式和超声波式接近开关的基准轴 reference axis for inductive， capaci-tive， non-mechanical magnetic and ultrasonic proximity switches
垂直于电感式、电容式，非机械磁性式、超声波式接近开关的感应面并通过其中心的轴。2.2.2，2
R型或D型光电式接近开关的基准轴 reference axis for type R and D photoelectric proximity switches
位于光电式接近开关发光器和受光器元件或镜头光轴之间中间位置的轴(见图1)。
2.2.2.3
T型光电式接近开关的基准轴 reference axis for type T photoelectric proximity switches
通过发光器中心且与其感应面垂直的轴。
2.2.3
标靶 standard target
用于动作距离和检测距离可比性测量的规定的物体。
2.2.4
自由区 free zone
接近开关周围的空间，在该空间内不应设置任何对接近开关特性产生影响的材料。
2.2.5
阻尼材料damping material
对接近开关特性有影响的材料。
2.2.6
非阻尼材料 non-damping material
对接近开关特性影响极小的材料。
2.2.7
反射声音材料 sound-reflecting material
能反射超声波并且能产生可检测回声的材料。
2.2.8
吸声材料 sound- absorbing material
对超声波的反射特性极弱并不能产生回声的材料。
2.2.9
埋入式接近开关 embeddable proximity switch
当任何阻尼材料设置在感应面平面的四周时其特性可以不受阻尼材料影响的开关
称埋入式接近开关。
2.2.10
非埋入式接近开关 non-embeddable proximity switch
如接近开关的感应面周围需要有一个自由区以保持其特性，这种接近开关称非埋入式接近开关。
2.1.11
感应面 sensing face
电感式接近开关的感应面 sensing face of an inductive proximity switch
能产生电磁场的接近开关的表面。
2.2.11.2
电容式接近开关的感应面 sensing face of a capacitive proximity switch
能产生电场的接近开关的表面。
2.2.11.3
超声波式接近开关的感应面 sensing face of an ultrasonic proximity switch
能发射和接受超声波的接近开关的表面。
2.2.11.4
非机械磁性式接近开关的感应面 sensing face of a non- mechanical magnetic proximity switch
能检测磁场变化的接近开关的表面。
2.2.12
发光器 emitter
提供光束所需的光源、透镜及所需电路的组合件。
2.2.13
受光器 receiver
能检测从发光器发射的光束存在与否的检测器、透镜和所需电路的组合件。
2.2.14
反光器 reflector
在R型光电式接近开关中，将光反射到受光器上所用的特定器件。
2.2.15
调整器adjuster
2.2.15.1
电容式接近开关的调整器 adjuster of a capacitive proximity switch
电容式接近开关中用于确定动作距离的部件。该部件用于补偿由于标靶材料、传输介质和安装条件对电容式接近开关的影响。
2.2.15.2
超声波式或光电式接近开关的调整器 adjuster of an ultrasonic or a photoelectric proximity switch
在超声波式或光电式接近开关中用于检测范围内动作距离整定的部件。
2.3接近开关的动作
2.3.1
动作距离 operation distance
S
动作距离是指标靶沿基准轴向感应面移近时能引起输出信号变化的距离。
2.3.1.1
额定动作距离 rated operating distance
Sn
额定距离是用于确定动作距离的约定量。它不考虑制造公差及如电压和温度等外界条件引起的变化量。
2.3.1.2
检测范围 sensing range
Sd
动作距离可调整的范围。
2.3.1.2.1
最小动作距离 minimum operating distance
超声波式或光电式接近开关规定检测范围的下限值。
2.3.1.2.2
最大动作距离 maximum operating distance
超声波式或光电式接近开关规定检测范围的上限值。
2.3.1.3
肓区 blind zone
感应面与最小动作距离间的区域，在该区内检测不到物体。
2.3.1.4
全发射角 total beam angle
当超声波式接近开关的声量降低到3dB时在其基准轴周围的立体角。
2.3.1.5
有效动作距离 effective operating distance
Sr
有效动作距离是指在规定的基准环境温度、额定电压和安装条件下所测得单只接近开关的动作。
2.3.1.6
可用动作距离 usable operating distance
Su
可用动作距离是指在规定条件下(见7.2.1.3.2)测得的单只接近开关的动作距离。
2.3.1.7
确保的动作距离 assured operating distance
Sa
在规定条件确保时接近开关正确动作后其动作点距其感应面的一段距离。
2.3.1.8
动作范围 operating range
ro
标靶横向接近会引起对射光电式或回射光电式接近开关输出信号发生变化的范围。
2.3.2
横向接近 lateral approach
标靶垂直于接近开关基准轴的接近。
2.3.3
轴向接近 axial approach
标靶的轴心保持在接近开关基准轴上的接近。
2.3.4
重复精度 repeat accuracy
R
有效动作距离在规定条件下(见7，2.1.4)的变化值。
2.3.5
回差 differential travel
H
标靶移近接近开关时的动作点和标靶移开接近开关时复位点之间的距离。
发光器
基准轴
ro
受光器
a) T 型 发光器和受光器-对射光电式
发光器和受光器
基准轴
ro
发光器
反光器盲区
b) R型 发光器-受光器和反光器-回射光电式
发光器和受光器
基准轴
标靶
Sd
标靶盲区
c)D型 发光器-受光器和标靶-漫射光电式
图1 光电式接近开关的检测范围和动作范围(见7.2.1.3和8.4)
2.4 开关元件的特性
2.41
开关元件的功能
2.4.1.1
接通功能 make function
在标靶被检测到时有负载电流，在标靶未被检测到时无负载电流的功。
2.4.1.2
分断功能 break function
在标靶被检测到时无负载电流，在标靶未被检测到时有负载电流的功能。
2.4.1.3
接通分断或转换功能 make-break， of changeover function
具有接通功能和分断功能的开关元件组合体。
2.4.1.4
接近开关的响应时间 response time for a proximity switch
当标靶进入或离开检测区后开关元件响应所需的时间。
2.4.1.5
光电式接近开关的接通时间 turn on time for a photoelectric proximity switch
当标靶进入检测区范围后且增益比(见2.4.6)为2时开关元件响应所需时间。
2.4.1.6
光电式接近开关的截止时间 turn off time for a photoelectric proximity switch
当标靶离开增益比(见2.4.6)为0.5的检测范围后，开关元件响应所需的时间。
2.4.2
非从动(快速)动作 independent(snap) action
其动作实质上与标靶的移动速度无关的开关元件功能。
2.4.3
操作频率 frequency of operating cycles
F
接近开关在规定的时间内所完成的操作循环次数。
2.4.4
起动前的延时 time delay before availability
tv
接近开关从接通电源电压时至准备好正确动作时止的时间间隔。
2.4.5
电流(I)
2.4.5.1
截止状态电流 off-state current
Ir
通过处于截止状态的接近开关的负载电路的电流。
2.4.5.2
最小动作电流 minimum operational current
维持开关元件导通状态所需的电流。
2.4.5.3
空载电源电流 no-load supply current
当三端或四端子接近开关不连接负载时其电源中得到的电流。
2.4.6
光电式接近开关的增益比 excess gain for a photoelectric proximity switch
光电式接近开关所接受到光亮度与光电式接近开关动作所需的光亮度之比。
2.4.7
光电式接近开关的环境光 ambient light for a photoelectric proximity switch
对本部分而言，环境光是指受光器接受到的除发射器发出的光以外的光。
盲区
检测范围
全发射角
基准轴
最小动作距离确保的动作距离（Sn）
有效动作距离（Sr）
最大动作距离
图2 超声波式接近开关的动作距离
3 分类
接近开关应按表1所示各种基本特性分类。其推荐尺寸参见附录A。
表1接近开关的分类
第一个位置
1位数 第二个位置
1位数 第三个位置
1位数 第四个位置
1位数 第五个位置
1位数 第六个位置
1位数
感应方式
3.1 机械安装方式
3.2 结构型式和尺寸
3.3 开关元件功能（输出）
3.4 输出型式
3.5 连接方式
3.6
I=电感式
C=电容式
U=超声波式
D=射光电式
M=非机被磁性式
R=回射光电式
T=对射光电式 1=埋入式
2=非理入式
3=埋入式和非埋入式 型式(1个大写字母)
A=圆柱螺纹型
B=圆柱光面型
C=方形截面长方体
D=矩形截面长方体
尺寸(2个数字)
表示直径或边长 A=接通NO
B=分断NC
C=通断转换(接通-分断)
P=由用户编用
S=其他
P=PNP输出
3或4接线端、直流
N=NPN输出
3或4接线端，直流
D=2接线端、直流
F=2接线端，交流
U=2接线端、直流或交流
S=其他
1=整体固定接头式
2=接插式
3=解旋式
9=其他
超声波式接近开关举例：
U
超声波式 3
埋入式或非埋入式 A30
圆柱螺纹型φ=30mm A
NO 接通功能 D
2接线端直流 2
接插式
3.1按检测方式分类
检测方式用一个大写字母表示，处于第一个位置。
3.2按机械安装方式分类
机械安装方式用一个数字表示，处于第二个位置。
3.3按结构型式和尺寸分类
结构型式和尺寸用一个大写字母和两个数字，处于第三个位置上。
大写字母表示结构型式，例如圆柱型或长方体型。
两个数字表示尺寸，例如圆柱型的直径或长方体型的一边长度。
3.4按开关元件的功能分类
开关元件的功能用一个大写字母表示，处于第四个位置上。
3.5按输出型式分类
输出型式用一个大写字母表示，处于第五个位置上。
3.6按连接方式分类
连接方式用一个数字表示，处于第六个位置上。
4 特性
4.1特性概述
接近开关的特性应用下列项目表示：
——动作条件(4.2)；
——额定值和极限值(4，3)；
额定电压(4，3.1)；
电流(4.3.2)；
额定电源频率(4.3.3)；
操作频率(4.3.4)；
正常负载特性和非正常负载特性(4.3.5)；
短路特性(4.3.6)；
——开关元件的使用类别(4.4)。
4.1.1电感式或电容式接近开关的动作
由电磁场中或电场中特定物体的存在与否确定接近开关的输出信号，该特定物体能吸收或改变由检测面发射的能。
4.1.2超声波式接近开关的动作
由检测区中特定物体的存在与否确定接近开关的输出信号，该特定物体能反射由感应面发射出的超声波能。
4.1.3光电式接近开关的动作
由特定物体的存在与否确定接近开关的输出信号，该特定物体能反射或截断由发射器发射的可见光和不可见光。
注：许多光电式接近开关的制造商已习惯地使用术语“入光动作”和“遮光动作”，在此情况下，所谓“入光动作”是指受光器受光引起输出元件处于接通(ON)状态，则该开关称为“入光动作”。所谓“遮光动作”是指受光器受光引起输出元件处于截止(OFF)状态，则该开关称为“遮光动作”。
4.1.4 磁性接近开关的动作
由特定物体的存在与否确定接近开关的输出信号，该特定物体在检测区磁场内会产生变化。
4.2动作条件
4.2.1电感式或电容式接近开关的动作距离(S)
动作距离之间的关系见图3。
4.2.1.1额定动作距离(Sn)
额定动作距离由有关的附录规定。
4.2.2超声波式接近开关的动作距离(S)
动作距离之间的关系见图4。
4.2.2.1检测范围(Sd)
检测范围数值在有关附录中规定。
4.2.3光电式接近开关的动作距离(S)
4.2.3.1检测范围(Sd)
对D型光电式接近开关，动作距离以检测范围的形式给出(Sd)
4.2.3.2动作范围(ro)
对T型和R型光电式接近开关，动作范围(ro)即为动作距离。
4.3接近开关和开关元件的额定值和极限值
基准轴
标靶
确保的动作距离Sa
感应面
接近开关
图3 电感式和电容式接近开关的动作距离之间的关系
（见4.2.1、7.2.1.3和8.4.1）
基准轴
标靶
最大动作距离Smax Smax+H
有效动作距离Sr
确保的动作距离Sa
最小动作距离Smin Smin+H
盲区
感应面
超声波式接近开关
图4 超声波式接近开关的动作距离之间的关系
（见4.2.2、7.2.1.3和8.4.1）
4.3.1 电压
接近开关和其开关元件应规定下列额定电压：
4.3.1.1额定工作电压(Ue)
额定工作电压(Ue)(或范围)交流不超过250V，直流不超过300V。
注：制造商应规定包括Ue允差在内的极限值之间的数值，即应规定UB.。
Ue和UB之间的关系如下：
额定工作电压(Ue)
4.3.1.2额定绝缘电压(Ui)
接近开关的额定绝缘电压是进行介电试验的电压值，该值与爬电距离有关。
对接近开关而言，最高额定工作电压被认为是额定绝缘电压。
4.3.1.3额定冲击耐受电压(Uimp)
IEC 60947-1：2007+A1：2010的4.3.1.3适用。
4.3.1.4电压降(Ud)
电压降是指当在规定的条件下工作电流流过接近开关时在其实际输出端之间测量的电压值。该值在7.2.1.15规定。
4.3.2电流
接近开关及其开关元件应规定下列电流：
4.3.2.1额定工作电流(Ie)
见7.2.1.11。
4.3.2.2最小工作电流(Im)
见7.2.1.12。
4.3.2.3截止状态电流(Ir)
见7.2.1.13。
4.3.2.4空载电源电流(Io)
三接线端或四接线端接近开关的空载电源电流由制造商规定。
4.3.3额定电源频率
交流电路的额定电源频率应为50Hz和(或)60Hz。
4.3.4 操作频率（f）
操作频率参见本部分的附录A的规定或由制造商规定。
4.3.5正常负载或非正常负载特性
4.3.5.1开关元件正常负载条件下的接通能力和分断能力及性能
开关元件应满足表4的要求。
注：对已规定了使用类别的开关元件，不必分别规定接通和分断能力。
4.3.5.2开关元件非正常条件下的接通能力和分断能力
开关元件应满足表5的要求。
注：对已规定了使用类别的开关元件，可不必分别规定接通能力和分断能力。
4.3.6短路特性
4.3.6.1额定限制短路电流
接近开关的额定限制短路电流预期值为100A，接近开关应能耐受住8.3.4规定的试验。
4.4开关元件的使用类别
表2给岀的使用类别是标准使用类别。其他形式的用途可由制造商与用户的协议确定，制造商在产品样本和目录中给出的参数也可构成上述的协议。
