标准编号:	GB/T 5230-2020
中文名称:	印制板用电解铜箔
英文名称:	Electrodeposited copper foil for printed board
中标分类:	H62    重金属及其合金
行业分类:	GB    国家标准
ICS分类:	77.150.30 77.150.30    铜产品 77.150.30
发布机构:	国家市场监督管理总局 国家标准化管理委员会
发布日期:	2020-09-29
实施日期:	2021-8-1
标准状态:	valid
替代旧标准:	GB/T 5230-1995 电解铜箔
翻译语言:	英文
文件格式:	PDF
中文字符数:	21000 字
翻译价格(元):	1470.0
交付时间:	付款后 1 个工作日

Codeofchina.com is in charge of this English translation. In case of any doubt about the English translation, the Chinese original shall be considered authoritative. This standard is drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 5230-1995 Electrodeposited copper foil. The following main technical changes have been made with respect to GB/T 5230-1995: ——Terms and definitions such as "elongation", "foil profile", "smooth side", and "matte side" are added (see Clause 3). ——The models are added in the quantity from 2 to 5 (see 4.1; Table 1 of the 1995 edition). ——Designation and labeling of copper foil are added (see 4.2 and 4.3). ——As for the deviation of length and width of copper foil sheets, the provision text "agreed by the supplier and the purchaser" is revised to "as specified in the procurement documents, with the allowable deviation of mm for the length and mm for the width or as agreed by the supplier and the purchaser" (see 5.2.1; 5.2.2.2 of the 1995 edition). ——The width deviation of copper foil roll is modified from 4 width ranges to "as specified in the procurement documents, and the allowable deviation of the width shall be mm or as agreed by the supplier and the purchaser" (see 5.2.2; Table 3 of the 1995 edition). ——The specifications of mass per unit area and thickness are added in quantity from 11 to 16, and the allowable deviation of mass per unit area includes "high precision" level (see Table 3; Table 2 of the 1995 edition). ——The requirements on profile type and profile of copper foils are added (see Table 4). ——The requirements on surface roughness of copper foils are modified (see 5.2.6; 5.7.3 of the 1995 edition). ——The requirements on physical properties of copper foils are modified (see Table 5; 5.3 of the 1995 edition). · E-01 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 9μm and 12μm are added; compared with the former standard, the tensile strength and elongation indexes the copper foils with a thickness of 18μm, 35μm and 70μm are raised; the specific properties indexes the copper foils with a thickness of 25μm are deleted and amended to "agreed by the supplier and the purchaser". · E-02 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 12μm are added; compared to the former standard, the tensile strength indexes for the copper foils with a thickness of 18μm, 35μm and 70μm foil are raised. · The tensile strength and elongation indexes for E-03, E-04 and E-05 copper foils are added, and the fatigue ductility index for E-05 foil is added. ——The requirements on "etchability," "chemical cleanability," "treatment transfer", "high temperature oxidation resistance" and "purity" are added(see 5.4.1, 5.4.2, 5.4.4, 5.4.5, 5.5). ——The requirement on mass resistivity for the copper foils with a thickness of 15μm is added (see Table 6). ——The modification is made to Clause 7 (Inspection rules): the inspection classification, test conditions, appraisal inspection and quality conformance inspection items, sampling and judgement are added (see Clause 7). ——Annex A (Informative) "Comparison of electrodeposited copper foil models between this standard and foreign standards" is added (see Annex A). ——Annex B (Normative) "Test methods for diameter and quantity of copper powder" is added (see Annex B). ——Annex C (Normative) "Measurement method of warpage of copper foil" is added (see Annex C). ——The seven annexes of GB/T 5230-1995 are deleted (see Annexes A, B, C, D, E, F and G of the 1995 edition). This standard was proposed by China Nonferrous Metals Industry Association. This standard is under the jurisdiction of SAC/TC 243 National Technical Committee on Nonferrous Metals of Standardization Administration of China.   The previous editions of the standard are as follows: ——GB/T 5230-1985 and GB/T 5230-1995. Electrodeposited copper foil for printed board 1 Scope This standard specifies the classification, designation and labeling, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, as well as quality certificates and order form (or contract) content of electrodeposited copper foils for printed board. This standard is applicable to electrodeposited copper foils for printed board (hereinafter referred to as "copper foil"). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced documents (including any amendments) applies. GB/T 2036 Terms for printed circuits GB/T 8888 Wrough heavy non-ferrous metal products - Packing, marking, transportation, storing and certificate of quality GB/T 29847-2013 Test methods for copper foil used for printed boards 3 Terms and definitions For the purposes of this standard, the terms and definitions given in GB/T 2036 and the following apply. 3.1 elongation ratio (expressed by percent) of the distance increment between the effective part markers of the specimen to that between the initial markers when the specimen breaks under tensile load [GB/T 31471-2015, Definition 3.1] 3.2 foil profile unevenness of a copper foil surface caused by processing and/or enhanced bonding treatment [GB/T 31471-2015, Definition 3.4] 3.3 arithmetical mean deviation of the profile Ra arithmetic mean of the absolute distances from the center line to the rough profile within the measured length [GB/T 31471-2015, Definition 3.5] 3.4 ten point height of irregularities Rz sum of the 5 largest profile peak height averages and the 5 largest profile valley depth averages within the sampled length 3.5 smooth side cathode surface, i.e. the side of an electrodeposited copper foil close to the cathode roll [GB/T 31471-2015, Definition 3.7] 3.6 matte side the other side corresponding to the smooth side of an electrodeposited copper foil [GB/T 31471-2015, Definition 3.8] 3.7 treatment transfer enhancing binder transferred from the copper foil roughening treatment surface to the laminate substrate 3.8 carrier support medium used to make thin or soft copper foils easy to process and use 3.9 copper foil with releasable carrier copper foil produced by electrodeposition method using a carrier as a cathode Note: copper foils with releasable carrier are mainly classified into etchable ones and detachable ones. 3.10 pinhole light-transmitting micro holes through a copper foil 3.11 penetrating point opaque pores 3.12 warpage degree of bending of a copper foil specimen relative to the horizontal surface, characterized by the maximum vertical distance (mm) between the warped surface and the horizontal surface 4 Classification, designation and labeling 4.1 Classification Copper foils are classified into 5 types by their characteristics, and their models and characteristics are shown in Table 1. Table 1 Models and characteristics of copper foils Model Characteristic E-01 Standard electrodeposited copper foil E-02 High-elongation electrodeposited copper foil E-03 High-temperature-elongation electrodeposited copper foil E-04 Annealable electrodeposited copper foil E-05 Low-temperature-annealable electrodeposited copper foil Note: the comparison table of electrodeposited copper foil models between this standard and foreign standards is detailed in Annex A. 4.2 Designation 4.2.1 Types of enhancing bonding treatment for copper foils The types of enhancing bonding treatments for copper foils may include: a) non-enhancing bonding treatment without anti-oxidation treatment, denoted by N; b) non-enhancing bonding treatment with dual-side anti-oxidation treatment, denoted by P; c) enhancing bonding treatment of matte side (anodic side) with dual-side anti-oxidation treatment, denoted by A; d) enhancing bonding treatment of both sides with dual-side anti-oxidation treatment, denoted by D; e) enhancing bonding treatment of smooth side (cathode side) with dual-side anti-oxidation treatment, denoted by R.

Foreword i 1 Scope 2 Normative references 3 Terms and definitions 4 Classification, designation and labeling 4.1 Classification 4.2 Designation 4.3 Labeling 5 Technical requirements 5.1 Appearance quality 5.2 Dimensions and their allowable deviations 5.3 Physical properties 5.4 Processing property 5.5 Purity 5.6 Mass resistivity 6 Test methods 6.1 Appearance quality 6.2 Dimensions and their allowable deviations 6.3 Physical properties 6.4 Processing properties 6.5 Purity 6.6 Mass resistivity 7 Inspection rules 7.1 Inspection and acceptance 7.2 Inspection classification 7.3 Test conditions 7.4 Appraisal inspection (type inspection) 7.5 Quality conformance inspection 8 Marking, packaging, transportation, storage and quality certificate 8.1 Marking 8.2 Packaging 8.3 Transportation, storage and quality certificate 9 Order form (or contract) contents Annex A (Informative) Comparison of electrodeposited copper foil models between this standard and foreign standards Annex B (Normative) Test methods for diameter and quantity of copper powder Annex C (Normative) Measurement method of warpage of copper foil Bibliography

印制板用电解铜箔 1 范围 本标准规定了印制板用电解铜箔的分类、代号及标记、技术要求、试验方法、检验规则及标志、包装、运输、贮存、质量证明书及订货单(或合同)内容。 本标准适用于印制板用电解铜箔(以下简称“铜箔”)。 2 规范性引用文件 下列文件对于本文件的应用是必不可少的。凡是注日期的引用文件，仅注日期的版本适用于本文件。凡是不注日期的引用文件，其最新版本(包括所有的修改单)适用于本文件。 GB/T 2036 印制电路术语 GB/T 8888 重有色金属加工产品的包装、标志、运输、贮存和质量证明书 GB/T 29847—2013 印制板用铜箔试验方法 3 术语和定义 GB/T 2036界定的以及下列术语和定义适用于本文件。 3.1 延伸率 elongation 试样在拉伸负荷下断裂时，试样有效部分标线间的距离增量与初始标线间距离之比的百分率。 [GB/T 31471—2015，定义3.1] 3.2 轮廓度 foil profile 由加工和(或)增强粘结处理引起铜箔表面的不平整度。 [GB/T 31471—2015，定义3.4] 3.3 轮廓算术平均偏差 arithmetical mean deviation of the profile Ra 在测量长度内，从中心线至粗糙轮廓所有绝对距离的算术平均值。 [GB/T 31471—2015，定义3.5] 3.4 微观不平度10点高度 ten point height of irregularitties Rz 在取样长度内，5个最大的轮廓峰高平均值与5个最大的轮廓谷深平均值之和。 3.5 光面 smooth side 阴极面，即电解铜箔贴近阴极辊的面。 [GB/T 31471—2015，定义3.7] 3.6 粗糙面 matte side 与电解铜箔光面相对应的另一面。 [GB/T 31471—2015，定义3.8] 3.7 处理转移物(处理完善性) treatment transfer 从铜箔粗化处理面转移到层压板基材上的增强粘结物。 3.8 载体 carrier 用来使薄或软的铜箔容易加工和使用的支撑介质。 3.9 载体铜箔 copper foil with releasable carrier 用载体作为阴极，采用电沉积方法生产的铜箔。 注：载体铜箔主要分为可蚀刻载体铜箔和可分离载体铜箔。 3.10 针孔 pinhole 贯穿铜箔的透光微孔。 3.11 渗透点 penetrating point 不透光的孔隙。 3.12 翘曲度 warpage 铜箔试样相对于水平面的弯曲程度，用翘起面与水平面之间最大垂直距离(mm)表征。 4 分类、代号及标记 4.1 分类 铜箔按特性不同分为5种，型号及特性见表1。 表1 铜箔型号和特性 型 号 特性 E-01 标准电解铜箔 E-02 高延伸性电解铜箔 E-03 高温延伸性电解铜箔 E-04 可退火电解铜箔 E-05 可低温退火电解铜箔 注：国内外电解铜箔型号对照参见附录A。 4.2 代号 4.2.1 铜箔的增强粘结处理类型 铜箔的增强粘结处理类型可分为： a) 未经增强粘结处理，不防氧化，用N表示； b) 未经增强粘结处理，双面防氧化，用P表示； c) 粗糙面(阳极面)增强粘结处理，双面防氧化，用A表示； d) 双面增强粘结处理，双面防氧化，用D表示； e) 光面(阴极面)增强粘结处理，双面防氧化，用R表示。 4.2.2 轮廓度 轮廓度用Ra和Rz表征，Ra用于表示铜箔光面(阴极面)的粗糙度或轮廓度，Rz用于表示粗糙面(阳极面)的轮廓度或粗糙度。铜箔粗糙面轮廓度类型代号如下(轮廓度参数见表4)： a) 未经处理或粗化用X表示； b) 标准轮廓，用S表示； c) 低轮廓，用L表示； d) 甚低轮廓，用V表示； e) 极低轮廓(平滑轮廓)，用HV表示。 4.2.3 质量保证等级 铜箔按照质量保证水平差异分为三个等级，分别用代号1、2、3标识，如果订货未指明等级，则为1级。质量保证等级适用性如下： a) 1级：适用于要求电路功能完整，机械性能和外观缺陷不重要的应用场合； b) 2级：适用于电路设计、工艺合格率及一致性要求允许局部区域不一致的应用场合； c) 3级：适用于要求质量保证等级最高的应用场合。 4.3 标记 铜箔的标记用型号、名义厚度、粘结增强处理、轮廓度及质量保证等级代号标记。标记图示如下： 质量保证等级(见4.2.3) 轮廓度(见4.2.2) 增强粘结处理类型(见4.2.1) 名义厚度(见表3) 铜箔型号(见表1) 示例： 标准电解铜箔、厚度18μm、未经增强粘结处理、双面防氧化、未经处理或粗化、标准轮廓、质量保证等级为2级的铜箔，标记为： E-01/18/P/XS/2 5 技术要求 5.1 外观质量 5.1.1 凹点和压痕 铜箔表面允许的凹点和压痕应符合表2规定。 表2 铜箔表面允许的凹点和压痕 质量保证等级 要求 凹点和压痕直径 凹点和压痕/个 1级，2级3级 ＞1.0 mm 0 ≤1.0 mm ≤2 不大于铜箔标称厚度的5％ 忽略不计 ＞0.38 mm 0 ≤0.38 mm ≤2 不大于铜箔标称厚度的5％ 忽略不计 5.1.2 皱折 铜箔不应有永久变形性的皱折。 5.1.3 划痕 铜箔划痕深度不应超过铜箔标称厚度20％；每300 mm×300 mm区域，划痕数不应超过3条；对深 度小于铜箔标称厚度5％的划痕可忽略不计。 5.1.4 缺口和撕裂 铜箔边缘不应有缺口和撕裂。 5.1.5 针孔和孔隙度(渗透点) 铜箔的针孔和孔隙度应符合以下规定： a) 标称厚度小于17.1μm铜箔，针孔和孔隙度个数由供需双方商定； b) 标称厚度等于17.1μm铜箔，每300 mm×300 mm区域，针孔和孔隙度不应超过3个； c) 标称厚度大于17.1 μm铜箔，每300 mm×300 mm区域，针孔和孔隙度不应超过1个。 5.1.6 其他 5.1.6.1 一般外观 铜箔面不应有灰尘、污物、腐蚀、盐类、油脂、指印、外来物等影响铜箔使用寿命、加工性能的外观缺陷，允许有不同表面处理方法引起的不影响铜箔使用的颜色差异。 5.1.6.2 铜粉 卷箔(或片箔)端面允许的铜粉最大直径和数量由供需双方商定。 5.2 尺寸及其允许偏差 5.2.1 片状铜箔的长度和宽度 片状铜箔的长度(L)和宽度(W)应按采购文件规定，长度允许偏差为 mm，宽度允许偏差为 mm或由供需双方商定。 5.2.2 卷状铜箔的宽度 卷状铜箔的宽度(W)应按采购文件规定，宽度允许偏差为 mm或由供需双方商定。 5.2.3 厚度 5.2.3.1 按6.2.3测定单位面积质量时，包括任何处理在内，各型号铜箔总厚度应符合表3规定。 5.2.3.2 铜箔的最小厚度应不小于表3规定标称厚度值的90％，最大厚度应不超过铜箔最大轮廓度(见5.2.5)与表3规定铜箔标称厚度110％之和；标准轮廓度铜箔，无最大厚度要求。 5.2.4 单位面积质量 包括任何处理在内，各型号铜箔单位面积质量及其允许偏差应符合表3规定。单位面积质量小于75.9 g/m2(标称厚度9 μm)的铜箔可带有载体(包括可分离载体和可蚀刻载体)。 表3 铜箔单位面积质量和厚度a 铜箔代码 名义厚度b μm 单位面积质量b g/m2 标称厚度b μm 单位面积质量允许偏差 g/m2 普通精度 较高精度 高精度 E 5 45.1 5.1 ±10％ ±5％ ±3％ Q 9 75.9 8.5 T 12 106.8 12.0 J 15 133.9 15.0 H 18 152.5 17.1 M 25 228.8 25.7 1 35 305.0 34.3 W 50 445.0 50.0 2 70 610.0 68.6 3 105 915.0 102.9 4 140 1 220.0 137.2 5 175 1 525.0 171.5 6 210 1 830.0 205.7 7 245 2 135.0 240.0 10 350 3 050.0 342.9 14 490 4 270.0 480.1 注：铜箔以单位面积质量供货，名义厚度只作为规格的代称。标称厚度是根据铜箔单位面积质量计算所得。铜箔代码根据IPC 4562而来，和名义厚度对应。 a 未列入本表的铜箔，单位面积质量和厚度由供需双方商定。 b 名义厚度每增加35 μm，单位面积质量增加305 g/m2，标称厚度增加34.3 μm。 5.2.5 轮廓度 当按6.2.4测定时，铜箔的轮廓度以微观不平度10点高度来表征，应符合表4规定。 表4 铜箔轮廓度 轮廓度类型 微观不平度10点高度Rz，不大于 μm S——标准轮廓 不适用 L——低轮廓 10.2 V——甚低轮廓 5.1 HV——极低轮廓 3.0 X——未处理或粗化 由供需双方商定 5.2.6 表面粗糙度 表面粗糙度要求适用于未经处理电解铜箔的光面(阴极面)，当按6.2.4测定时，表面粗糙度以轮廓算术平均偏差来表征，其Ra应不大于0.43 μm。 5.2.7 翘曲度 铜箔的翘曲度要求由供需双方商定。 5.3 物理性能 5.3.1 抗拉强度 按6.3.1检验时，抗拉强度应符合表5规定。 5.3.2 疲劳延展性 按6.3.2检验时，疲劳延展性应符合表5规定。 5.3.3 延伸率 按6.3.3检验时，延伸率应符合表5规定。 5.3.4 剥离强度 按6.3.4检验时，剥离强度应符合供需双方的规定。 5.3.5 载体分离强度 按6.3.5检验时，铜箔与载体(膜或箔)分离强度应由供需双方商定。