Eletrical installatoins of buildings - Part 5: Selectrion and erection of electrical equipment - Section 548: Earthing arrangements and equipotential bonding for information technol
548.1 General
548.1.1 Scope and object
This standard covers earthing and equipotential bonding for information technology installations and similar equipment requiring interconnections for data exchange purposes.
This standard may also be used for other electronic equipment which is susceptible to interference.
Notes:
1 Information technology equipment includes all forms of electrical and electronic business equipment and telecommunications equipment (for more information regarding the term “information technology equipment” see the scope of GB 4943).
Examples of equipment and installations to which this standard may apply are:
- telecommunication and data communication or data processing equipment, or installations using signaling with earth return in internal connections and external connections to a building;
- d.c. power supply networks serving information technology equipment inside a building;
- private automatic branch exchange (PABX) equipment or installations;
- local area networks (LAN);
- fire alarm systems and intruder alarm systems;
- building services installations, e.g. direct digital control systems;
- systems for computer-aided manufacturing (CAM) and other computer-aided services.
2 Throughout this standard the term “functional” concerns the use of earthing and equipotential bonding for signaling and EMC purposes.
3 This standard does not consider the possible influence of lightning (see IEC 1024-1). GB 16895.12 and GB/T 16895.16 (idt IEC 60364-4-444) cover protection against overvoltages of atmospheric origin and due to switching, and protection against electromagnetic interference (EMI) in installations of buildings.
4 In case of EMC problems associated with existing electrical installations of buildings, see Appendix A.
5 This standard does not cover requirements for connection of equipment with high-leakage-current, for which see 707.1~707.4 of GB/T 16895.9.
548.1.2 Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of this standard. At the time of publication, all the editions listed are valid. All standards are subject to revision, and parties to agreements based on this standard are encouraged to investigate the possibility of applying the most recent editions of the standards indicated below.
GB 4943-1995 Safety of Information Technology Equipment including Electrical Business Equipment (idt IEC 60950:1991 )
GB 14821.1-1993 Electrical Installations of Buildings - Protection Against Electric Shock (eqv IEC 60364-4-41:1992)
GB 16895.3-1997 Electrical Installations of Buildings - Part 5: Selection and Erection of Electrical Equipment - Chapter 54: Earthing Arrangements and Protective Conductors (idt IEC 60364-5-54:1980)
GB/T 16895.9-2000 Electrical Installations of Buildings - Part 7: Requirements for Special Installations or Locations - Section 707: Earthing Requirements for the Electrical Installation of Data Processing Equipment (idt IEC 60364-7-707:1984)
GB 16895.11-2001 Electrical Installations of Buildings - Part 4: Protection for Safety - Chapter 44: Protection against Overvoltages - Section 442: Protection of Low-voltage Installations against Temporary Overvoltages and Faults between High-voltage Systems and Earth (idt IEC 60364-4-442:1993)
Foreword I
IEC Foreword II
548.1 General
548.2 Earthing Requirements of Information Technology Installations or Equipment
548.3 Use of the Main Earthing Terminal
548.4 Compatibility of Information Technology Installations with PEN Conductors in Buildings
548.5 Electrolytic Corrosion Protection
548.6 Provisions for Electromagnetic Compatibility (EMC)
548.7 Earthing and Equipotential Bonding for Information Technology Installations
Appendix A (Informative) Signal Connections
Appendix B (Informative) Provisions for Electromagnetic Compatibility (EMC)
Appendix C (Informative) Signal Transmission between Different Areas of Equipotential Bonding
